


Cascade Microtech Expands Grypper Line of Device-Footprint Test Sockets With G40 Grypper for 0.4 mm+ Pitch BGA Devices
BEAVERTON, OR--(Marketwire - December 8, 2009) - Cascade Microtech, Inc. (
In today's business environment, speeding time-to-market and minimizing costs are critical requirements for survival. The G40 Grypper delivers tangible benefits for the validation and debug of high-ball-count BGA devices for portable electronics, RF, wireless, PC and infrastructure markets. Engineering development, characterization, yield analysis and failure analysis can rapidly proceed on packaged devices or wafer-level chip-scale packages without the added expense or delays of designing and producing separate test boards.
The G40 Grypper solders directly to the device footprint and requires no socket lid. Signal integrity is maintained by using a short signal path to achieve low inductance and low insertion loss. The G40 Grypper PCB footprint is identical to the package, enabling test and validation on the system PCB instead of special test boards. Thus the G40 Grypper socket allows customers the ability to evaluate, debug and characterize multiple devices in their actual system environment without the cost and yield loss of soldering and de-soldering. Grypper technology can address multiple package types to maximize time-to-market improvements and cost savings.
"Cascade Microtech continually invests in innovative tools to help semiconductor companies cost-effectively solve their toughest test and measurement challenges," said Geoff Wild, President, Cascade Microtech, Inc. "This extension of the Grypper test socket line exemplifies our commitment to keeping pace with the technology requirements necessary for our customers to remain competitive in today's market."
About Cascade Microtech, Inc.
Cascade Microtech, Inc. (
Cascade Microtech is a registered trademark, and Grypper is a trademark of Cascade Microtech, Inc. All other trademarks are the property of their respective owners.